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Canvendor · Chandler, Arizona
Job Title :
IC Packaging Design Engineer
Job
Chandler, AZ/ Hillsboro, OR (Onsite)
As an IC Packaging Design Engineer, you'll work on physical design and layout of IC packages, driving substrate design and SI/PI-aware implementation for high-performance semiconductor products. You'll collaborate closely with cross-functional teams to ensure designs meet performance, manufacturability, yield, and reliability targets.
Perform physical design and layout of IC packages
Execute substrate design and layout
Implement SI/PI-aware design practices
Design for performance, manufacturability, yield, and reliability (DFM/DFY/DFR)
Ensure design rule compliance across all deliverables
Use Siemens (Mentor) Xpedition (XPD) or Cadence Allegro/Advanced Package Designer (APD/SiP) for design execution
Bachelor's or Master's degree in Electrical/Electronics Engineering
Senior-level: ~10+ years in IC packaging / package design, OR
Mid-level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package design
Strong hands-on experience in Siemens Xpedition (XPD) or Cadence Allegro/APD (SiP)
Proven experience in substrate design, SI/PI-aware implementation, and design rule compliance
Details
| Company | Canvendor |
| Location | Chandler, Arizona |
| Type | FULL TIME |
| Niche | Engineering professionals (excluding electrotechnology) |