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NuByt, Inc · San Jose, California
Job Description
Job Description
Perform top-level physical integration, layout assembly, and connectivity checks.
Own bump placement, bump assignment, and bump/RDL routing.
Develop and run top-level DRC/LVS decks and drive physical verification closure.
Debug and resolve full-chip DRC/LVS violations, connectivity issues, and integration errors.
Coordinate with package design, digital implementation, IP, and foundry teams.
Perform chip-package interface checks, bump map verification, and other tapeout signoff checks.
Prepare and validate final full-chip GDS/OASIS and signoff deliverables for tapeout.
** Required Qualifications:**
Strong hands-on experience in full-chip physical integration and hierarchical GDS/OASIS assembly.
Proficiency with tools such as Cadence Innovus, Siemens Calibre, Synopsys IC Validator, or equivalent.
Ability to independently drive full-chip integration and signoff to completion.
Details
| Company | NuByt, Inc |
| Location | San Jose, California |
| Type | FULL TIME |
| Niche | Architecture and Engineering Occupations |